Chip On Board: Technology for Multichip Modules

By John H. Lau

Book Details

• Title: Chip On Board: Technology for Multichip Modules

• Author: John H. Lau

• Publisher: Springer / Van Nostrand Reinhold (1994)

• Format: Hardcover, 556 Pages

• ISBN-13: 9780442014414

• Subject: Microelectronics, Integrated Circuit Packaging, MCM & COB Technology

Condition Overview

• Clean, unmarked text pages free of highlighting or scribbles.

• Tight, original binding and sturdy spine structure.

• Minor exterior shelf wear; overall well-preserved engineering reference copy.

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