New Silicon Wafer Curing Machine with Programmable Smart Temperature Control, Heating Stage, Liftable Pins, and Heating Plate

Model: 12T20 Touch-Control Multi-Stage

Power Supply: Single-phase 220V

Rated Power: 1 kW

Temperature Range: Room temperature to 300°C

Temperature Stability: ±1%, at 150°C (with lid closed)

Timer Duration: Set according to process parameters

Curing Plate Dimensions: 195 x 195 mm

Dimensions: 220 x 240 x 200 mm (H)

Weight: 7 kg

Model: 12T25 Touchscreen Multi-Stage

Power Supply: Single-phase 220 V

Rated Power: 1.2 kW

Temperature Range: Room temperature to 300°C

Temperature Stability: ±1%, at 150°C (with lid closed)

Timer Duration: Set according to process parameters

Curing Plate Dimensions: 250 x 250 mm

Overall Dimensions: 270 x 270 x 230 mm (H)

Weight: 9 kg

Model: 12T25 Touchscreen Multi-Stage with Piston Lift

Power Supply: Single-phase 220 V

Rated Power: 1.5 kW

Temperature Range: Room temperature to 300°C

Temperature Stability: ±1%, at 150°C (with lid closed)

Timer Duration: Set according to process parameters

Curing Plate Dimensions: 250 × 250 mm

Overall Dimensions: 270 × 270 × H 230 (270) mm

Weight: 11 kg

Notes: The three ejector pins in the first ring are spaced between 40 and 50 mm in diameter; the three ejector pins in the second ring are spaced between 125 and 135 mm in diameter


General Note 1: The heating platform is made of 6061 aluminum alloy with a thickened design to maximize temperature stability

General Note 2: The lid is hinged; adjust the hex socket screws on both sides to set the lid’s damping

General Note 3: The lid is made of stainless steel