Second-Generation Smart BGA Chip Grinding Machine for Mobile Phone Motherboards, SSDs, and Fully Automatic Screen IC Repair

Name: Chip Grinding Machine

Maximum No-Load Speed: 24,000 r/min

Input Voltage: 12V DC

Product Dimensions: 204 × 162 × 179 mm

Workbench Dimensions: 197 × 93 mm

Application: For grinding touch ICs and motherboard chips