Product Description

Key Features
  • Supports Intel Socket LGA 1700/1851
  • Copper Heatsink with Skiving Fins
  • Supports up to 195W TDP
  • Pre-applied Shin-Etsu X23-8195 Thermal Grease
  • Dimensions: 3.7" x 3.7" x 1.06"

Product Brief

Recommend for Intel Alder Lake S Processor, Socket LGA 1700/1851, Copper heatsink with skiving fins. Support 195 Watts CPU Power Heat Dissipation for 1U & Up Server Solution.

Technical Specifications

Manufacturer Dynatron
Product ID Q17
CPU Support Socket LGA 1700/LGA1851
Up to 195W TDP
Dimensions 94 x 94 x 27mm
3.7" x 3.7" x 1.06" (in inches, approximate)
Features Shin-Etsu X23-8079-2 Thermal Grease

International Shipping Details

  • Import taxes, customs duties and all associated fees during importation will be the responsibility of the purchaser.
  • Please note that USPS does NOT guarantee delivery dates for their international services. Therefore, we cannot Provide a guaranteed delivery date if you choose USPS international mailing services.
  • USPS Priority Mail International has an estimated delivery transit time of 6-11 business days.
  • USPS Express Mail International has an estimated delivery transit time of 3-5 business days.
  • In addition to the estimated delivery time, you should expect additional delay due to customs control and Processing times by the local postal authority in your country.
  • No transit-time estimates are available for USPS First Class Mail International packages and no tracking information is available.
  • If you have any time constraints, please ship Express Mail service.
  • If you require tracking information and insurance, select Express Mail service.
  • For more information on international shipping, please visit: MITXPC/International-Shipping
  • Please review our store policies here: MITXPC/Store-Policies