Enhance electronics repair with RELIFE BGA Soldering Paste – delivers precise application, quick curing, and reliable conductivity for efficient soldering of precision components.

Key Features:
▲ Efficient Soldering: Boost welding speed and accuracy for professional electronics repairs.
▲ Rosin Formula: Provides excellent conductivity and oxidation resistance during use.
▲ Precise Syringe Design: Control paste amount accurately to minimize waste.
▲ Quick Curing: Reduce soldering time for higher work efficiency.
▲ Wide Compatibility: Supports BGA chip reballing, circuit board repair, and component welding.

Specifications:
Material: High-Quality Rosin
Size: Standard Syringe Packaging
Weight: Lightweight Design
Application: BGA Chip Reballing, Circuit Board Repair, Electronic Component Soldering
Feature: Non-Corrosive Formula

Package Includes:
1 x RELIFE BGA Soldering Paste Rosin Syringe

Note: Colors may slightly vary by screen ,Size tolerance: ±0.2inch.