5X CD4503BE HARRIS CMOS Hex 3-State Buffer 20V 6-Channel Non-Inverting DIP-16 IC
5 Pieces - CD4503BE HARRIS CMOS Hex 3-State Buffer 20V 6-Channel Non-Inverting DIP-16 IC
| Specification | |
|---|---|
| Supply Voltage-Nom (Vsup) | 5 V |
| Propagation Delay (tpd) | 150 ns |
| Prop. Delay@Nom-Sup | 150 ns |
| Number of Functions | 2 |
| Number of Bits | 4 |
| Surface Mount | NO |
| Package Code | DIP |
| Load Capacitance | 50 pF |
| Count Direction | UNIDIRECTIONAL |
| Output Characteristics | 3-STATE |
| Family | 4000/14000/40000 |
| Logic IC Type | BUS DRIVER |
| Technology | CMOS |
| Additional Feature | ONE FUNCTION WITH TWO BITS |
| Control Type | ENABLE LOW |
| Max I(ol) | 11.2 mA |
| Number of Ports | 2 |
| Output Polarity | TRUE |
| Power Supplies | 5/15 V |
| Power Supply Current-Max (ICC) | 120 µA |
| Supply Voltage-Max (Vsup) | 18 V |
| Supply Voltage-Min (Vsup) | 3 V |
| Temperature Grade | MILITARY |
| Translation | N/A |
| Operating Temperature-Max | 125 °C |
| Operating Temperature-Min | -55 °C |
| Number of Terminals | 16 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Packing Method | TUBE |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 mm |
| Terminal Position | DUAL |
| Seated Height-Max | 5.08 mm |
| Width | 7.62 mm |
| Length | 19.305 mm |
| Package Description | DIP, DIP16,.3 |
| Pin Count | 16 |
| Manufacturer | HARRIS |
Shipping Policy
Our go-to options for small to medium items are USPS Ground Advantage and USPS Priority Mail, known for their reliable tracking and peace of mind.
Smaller items might qualify for USPS First Class Mail. Contact us to discuss this option before purchasing.
Note: This method is less recommended due to the potential for delays.
Return Policy
We offer a 30-day return policy, no questions asked. If you choose to provide a reason for the return, it will assist us in improving and fix the issue.
Packaging
Our items are packaged according to their needs—some in ESD bags with pins secured in protective sponge, others in foam-enclosed boxes. For larger quantities, options include broken tubes for transistors or cartons. We welcome your suggestions for packaging preferences.