NEW Lenovo ThinkSystem SR650 2x Gen 1/2 Scalable CPU 24-DIMM 8-Bay 2U CTO Server
Model No: 7X06A0NWEA

NEW
2 Year Warranty

Included:

  • 1 x NEW Lenovo ThinkSystem SR650 2x Gen 1/2 Scalable CPU 24-DIMM 8-Bay 2U CTO Server
    • 1 x Heatsink - 01KP653
    • 1 x 8-way Backplane for up to 8 x 2.5" SAS/SATA Hot-Swap Drives (24x Total Bay Chassis) - 01GV283
    • 24 x DDR4 DIMM Slots Total (12-Per CPU)
    • 1 x Lenovo ThinkSystem 9350-8i PCIe 12Gb/s SAS/SATA RAID Controller with 2GB Cache - 03GX083 + Battery - 03GX255
      • RAID Levels 0, 1, 5, 6, 10, 50, 60
    • 5 x Fan Modules - 01KP693
    • 1 x 750W Power Supply - 02YF623
    • XCC Enterprise
  • 1 x Set Of Rails - 00YK494
  • 1 x Lenovo 8.5ft C13 - C14 Power Cable - 39M5377
Specification:

Form factor: 2U rack-mount

Processor:
  • Up to two 2nd Gen Intel Xeon Bronze, Silver, Gold, or Platinum processors:
    • Up to 28 cores (2.7 GHz core speeds).
    • Up to 3.9 GHz core speeds (8 cores).
    • UPI links up to 10.4 GT/s (2 UPI links used).
    • Up to 38.5 MB cache.
    • Up to 2933 MHz memory speed.
  • 1st Gen Intel Xeon processors are also supported.
Chipset: Intel C624

Memory:
  • Up to 24 DIMM sockets (12 DIMMs per processor; six memory channels per processor with two DIMMs per channel). Support for RDIMMs, LRDIMMs (1st Gen processors only), or 3DS RDIMMs. Memory speed up to 2933 MHz depending on the processor selected. Memory types cannot be intermixed.
Persistent memory:
  • Up to 12x TruDDR4 2666 MHz DCPMMs in the DIMM slots. Not supported with 1st Gen Intel Xeon SP processors.
Memory protection:
  • Processor's integrated memory controllers: Error correction code (ECC), SDDC (for x4-based memory DIMMs), ADDDC (for x4-based memory DIMMs, requires Intel Xeon Gold or Platinum processors), memory mirroring, memory rank sparing, patrol scrubbing, and demand scrubbing.
  • DCPMM's onboard memory controllers: ECC, SDDC, DDDC, patrol scrubbing, and demand scrubbing.
Note: In the configurations with DCPMMs, memory mirroring is supported only in the App Direct mode (other DCPMM modes do not support memory mirroring) and applies only to the RDIMMs or 3DS RDIMMs (DCPMMs are not mirrored). Memory sparing is not supported in the configurations with DCPMMs.

Memory capacity:
  • Memory DIMMs only: Up to 3 TB with up to 24x 128 GB 3DS RDIMMs (Up to 1.5 TB per processor).
  • Memory DIMMs and persistent memory modules:
    • App Direct Mode: Up to 7.5 TB with up to 12x 128 GB 3DS RDIMMs and up to 12x 512 GB DCPMMs (Up to 3.75 TB per processor).
    • Memory Mode: Up to 6 TB with up to 12x 512 GB DCPMMs (Up to 3 TB per processor).
  • Note: Server configurations with more than 1 TB of memory capacity per socket (including DCPMMs and RDIMMs or 3DS RDIMMs) require processors that support up to 2 TB (M-suffix) or 4.5 TB (L-suffix) per socket. Server configurations with more than 2 TB of memory capacity per socket (including DCPMMs and RDIMMs or 3DS RDIMMs) require processors that support up to 4.5 TB per socket (L-suffix).
Drive bays:
  • 1 x 8-way Backplane for up to 8 x 2.5" SAS/SATA Hot-Swap Drives (24x Total Bay Chassis)
Storage Controller: None
Optical drive bays: None

Network interfaces:
  • Onboard LOM slot for up to 4x 1/10 Gb Ethernet ports:
    • 2x or 4x 1 GbE RJ-45 ports (no 10/100 Mb support)
    • 2x or 4x 10 GbE RJ-45 ports (no 10/100 Mb support)
    • 2x or 4x 10 GbE SFP+ ports (no 10/100 Mb support)
  • Optional Mezzanine LOM (ML2) slot for dual-port 10 GbE cards with SFP+ or RJ-45 connectors or single- or dual-port 25 GbE cards with SFP28 connectors.
  • 1x RJ-45 10/100/1000 Mb Ethernet systems management port.
I/O expansion slots:
  • Up to seven slots. Slots 4 and 7 are the fixed slots on the system planar, and the remaining slots depend on the riser cards installed. The slots are as follows:
    • Slot 1: PCIe 3.0 x16 or PCIe 3.0 x8; full-height, half-length (PCIe x16 slot can be single- or double-wide)
    • Slot 2: PCIe 3.0 x8; full-height, half-length (not present if Slot 1 is PCIe x16 double-wide or Slot 3 is ML2 x16)
    • Slot 3: PCIe 3.0 x8, or PCIe 3.0 x16, or ML2 x8, or ML2 x16; full-height, half-length
    • Slot 4: PCIe 3.0 x8; low profile (vertical slot on system planar)
    • Slot 5: PCIe 3.0 x16; full-height, half-length
    • Slot 6: PCIe 3.0 x16; full-height, half-length
    • Slot 7: PCIe 3.0 x8 (for an internal storage controller)
  • Slots 5 and 6 require the second processor to be installed. Single-wide PCIe x16 Slot 1 requires the second processor to be installed.
Ports:
  • Front: 1x USB 2.0 port with XClarity Controller access and 1x USB 3.0 port
  • Rear: 2x USB 3.0 ports and 1x VGA port
Cooling:
  • Five (one processor) or six (two processors) hot-swap single-rotor system fans with N+1 redundancy.
Power supply:
  • Up to two redundant hot-swap 550 W, 750 W, or 1100 W (100 - 240 V), or 1600 W (200 - 240 V) High Efficiency Platinum AC power supplies, or 750 W (200 - 240 V) High Efficiency Titanium AC power supplies. HVDC support (PRC only).
Video:
  • Matrox G200e with 16 MB memory integrated into the XClarity Controller. Maximum resolution is 1920x1200 at 60 Hz with 32 bits per pixel.
Systems management:
  • XClarity Controller (XCC) Standard, Advanced, or Enterprise (Pilot 4 chip), proactive platform alerts, light path diagnostics, XClarity Provisioning Manager, XClarity Essentials, XClarity Administrator, XClarity Integrators for VMware vCenter and Microsoft System Center, XClarity Energy Manager, Capacity Planner.

VAT @ 20% INCLUDED IN PRICE - VAT INVOICE PROVIDED
£900 excluding VAT
              
VAT IS NOT PAYABLE BY PURCHASERS OUTSIDE OF THE UK

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