Features: Enhances the performances and extend the life For RPI 4B 1G 2G 4G development board with our efficient heat sink Pad, provide optimaled heat management.
Copper component for better heat conductivity, this 4piece set ensures comprehensive coverage and easy installation and not need for special tools.
For electronics enthusiasts, developers, and project creators who require stable operation for their devices.
Perfectly for long running development board projects such as home systems and robotic control applications, where need consistent performances.
Ensuring For RPI 4B operates smoothly and efficiently, making it a reliable choice for any demanding task.

Specifications: Name：Heatsink Pad
For RPI 4B 1G 2G 4G Development Board
Component： Copper
Quantity: 4Pcs/Set
Size: 6x6mm/0.24x0.24in 8x8mm/0.31x.031in 10x15mm/0.39x0.59in 15x15mm/0.59x0.59in
Thickness about 5mm/0.2inch

Package Includes: 1Set Headsink Pad

note: Please allow 1-2cm errors due to manual measurement.
Please allow for slight color differences due to different display resolution.