Lead-Free Soldering Wire from ATTEN is made up of 99.3% Tin and 0.7% Copper. Solder wire diameter 0.5mm, 0.8mm or 1mm allows for a wide range of uses from fine SMD components to large footprint through-hole parts.

Sophisticated Technology

Low Melting Point, Good Activity, High Insulation Resistance. High soldering speed can help to reduce the thermal shock to the components and lower operator's soldering time.

Fresh Raw Materials

By using high purity Tin ingot materials + electrolytic lead and special process. Our Solder Wire can keep high soldering speed, less residue, good wettability, excellent thermal and electrical conductivity.

Safe and Reliable

Excellent oxidation-resistance, wettability and expanding capability can effective avoid bridging and solder projection. Also the efficient oxidation film can form a protect film at the surface of the welding spot to lower the oxidation reaction and keep bright welding spot.

Specification:

- Diameter: 0.5mm / 0.8mm / 1mm
- Core: Rosin Flux Solid Core
- Composition: 99.3% Tin, 0.7% Copper
- Melting Point: 217-220℃
- Weight: 50g / 100g / 500g