TECHNICAL DATA SHEET
 
CATEGORY:             LEAD-FREE ALLOY NAME:              CASTIN 
 
 
FEATURES
 • LOWEST COST SN-AG-CU ALLOY • LOW MELTING POINT FOR A PB-FREE ALLOY (217°C)  • EXCELLENT SOLDER JOINT RELIABILITY • SUPERIOR JOINT STRENGTH THAN SN/PB AND SN/AG  • STRAIN RELIEVING CHARACTERISTICS • EXCELLENT THERMAL & MECHANICAL FATIGUE RESISTANCE • LOW ALPHA EMISSIONS • LOW DROSSING & COPPER DISSOLUTION IN WAVE
 DESCRIPTION CASTIN is a lead-free alloy that contains tin, silver, and copper, with the addition of a grain-refining and melting temperaturedecreasing dopant. CASTIN is a virtual drop-in replacement for 63Sn/37Pb for wave soldering and hand soldering applications and has proven to perform very well in SMT applications.  When used in wave soldering, CASTIN produces less dross than other solder alloys, wets well, and provides excellent joint strength.  In SMT applications, CASTIN reduces intermetallics, produces strong solder joints, and has excellent mechanical fatigue resistance.  CASTIN may be used with most existing equipment, processes, coatings, and flux chemistries.  The CASTIN alloy is available in bar, cored and solid wire, foil, preforms, powder, and water soluble, rosin, and no-clean solder pastes.  CASTIN solder products pass all applicable IPC specifications, including IPC-J-STD-006.
 PHYSICAL PROPERTIES
 
Tensile Sn63/Pb37 CASTIN UTS (ksi) 4.92 5.73 Yield Strength (ksi) 4.38 4.86 Young’s Mod of Expansion (msi) 4.87 7.42    Compression   Elastic Modulus (ksi) 3.99 4.26 YS (ksi) 4.52 4.33 Stress (ksi) 7.17 8.54
 
 
 
   CASTIN MELTING POINT 217°C
 
ALLOY COMPOSITION in Percent Ag: 2.5 ± 0.25  Al: = 0.001 As: = 0.05 Au: = 0.05 Bi: = 0.03 Cd: = 0.001 Cu: 0.75 ± 0.25 Fe: = 0.08 In: = 0.01 Ni: = 0.005 Sb: 0.50 ± 0.25 Sn: Balance Zn: = 0.005
 
HANDLING Refer to the specific Material Safety Data Sheet and the handling section of the individual Technical Data Sheets for the chemistry type of CASTIN  solder paste being used.
 
FLUX COMPATIBILITY CASTIN  is compatible with all major electronic grade fluxes on the market today, and is available in paste and wire form in  noclean, water soluble and rosin chemistries. 
 
 
 
 
 
CLEANING Refer to the liquid flux manufacturer’s data sheet for specific cleaning information, or refer to the cleaning section of the individual AIM solder paste technical data sheets for the recommended cleaning information.
 
 
 
TEMPERATURE REQUIREMENTS
 
APPLICATION RECOMMENDED TEMPERATURE      REFLOW SOLDERING     PEAK TEMPERATURE 235° - 245°C  (455° - 473°F)      WAVE SOLDERING    POT TEMPERATURE OF 260°C (500°F )      HAND SOLDERING    TIP TEMPERATURE OF 370° - 425°C (700° - 800°F)
 
SAFETY   • Use with adequate ventilation and proper personal protective equipment. • Refer to the accompanying Material Safety Data Sheet for any specific emergency information. • Do not dispose of any hazardous materials in non-approved conta

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