Heat conductive silicone thermal compound pads. You will need to use this when you reinstall your CPU and heat sink for your notebook.

100% New Heat sink thermal pads.

Usage : This product is suitable for GPU CPU VGA BGA Bridge Chips
•Continuous Temp: -40℃ to 120℃
•Thermal Conductivity: 3.2w/m-K
•Size:15mm*15mm*1.5mm(W*L*H)/pcs
•Thickness:1.5mm