MECHANIC-Solder paste 16G/30G/35G42G

Brand:HK MECHANIC

Model:XG

Features:

100% original new

Alloy:Sn63/Pb37

Microns:24-45um

MESH:-325+500

Note:

1. Harmful by inhalation and if swallowed.
2. Danger of cumulative effects.
3. Keep away from food,drink and animal feeding stuffs.
4. When using do not eat,Drink or smoke.
5. Avoid prolonged or repeated contact of any skin with solder paste. In case of solder paste ingestion see a doctor immediately.

6.Store container welll closed and cool

Package will be include:

1PCS * MECHANIC ( XG-30 16G, XG-40 30G,XG-50/35G 42G)

Solder paste-Welding Treasure 50g

Features:

100% brand new and high quality.

Rosin flux is used to facilitate soldering.

It cleans and prevents metal oxidation which allows solder to create strong, long lasting mechanical and electrical bonds. It also acts as a wetting agent, increasing the flow of solder and the efficiency of the soldering process.

Cleans and prevents oxidation

Increases flow of molten solder

Neutral PH 7 ¡À0.3

Net Wt. 50 g / 1.7637 oz

Specifications:

Material:Rosin

Box Size: approx. 75*75*20mm

Net weight: 50g

Package Included:

1 x 50g Rosin Soldering Flux Paste

Solder paste BST-328/BST-705

Specification:

Brand new

Weight: approx.40G

White and plump solder joint.

No false welding, strong adhesive with solder iron tip.

Viscous force lasting, not easy to dry.

Used for the laptop/computer/mobile phone/home appliances SMD IC and BGA IC repairing ,tools for chip-level repairing.

Is a must product for mobile phones and precision equipment maintenance.

Package included:

1 x solder paste

Solder paste-UP301B for low temperature

Features:

- Flux does not contain fluorine and other environmental damage to the material,

the main raw material for natural resin or plant components, easy to biodegradable;

- moderate viscosity, good thixotropy, easy to collapse after printing;

- Suitable for injection, stencil printing, etc, which can show good wettability on substrates with different materials.

- Good welding performance over a wide range of reflow temperatures;

- less residue after welding, tin solder on the spot full of bright and has a large insulation resistance,

will not corrode the pcb, can achieve the requirements of no-clean;

- Excellent ICT test performance, no miscarriage of justice.

Specification:

Alloy: Sn42Bi58

Melting point: 138 ° C

Particle size: 20-45 μm

Solder paste content: 14 ± 1wt%

Halogen content: & lt; 0.005 wt%

Viscosity: 160 Pa.s

Insulation resistance:> 1 × 1012Ω temperature

Size: 10cm

Suitable For: Such as Mp3 / Mp4 / U disk and other digital products and DVD decoders,

electronic equipment, such as board products, such as the board

Storage conditions: In the 2-10 environment storage period of 6 months, not below 0 in the conditions of storage,

use before thawing 2-4 hours or more room temperature.

Package includes:

1 x 50g Solder paste

Solder paste-NC-559-ASM

Introduction:

Rework help paste applied to mobile phone PCB, BGA and SMD's PGA etc.

It's used in low ionic activator system, tin-run speed

Low level of smoke,surface insulation resistance value is high residue after curing

Therefore, the electrical properties of the cell phones and other communications products, very little interference

Features:

NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR

Recommended for BGA, CSP and other solder ball array repair and fill the ball

When using smoke less, no residue. Affordable.

Suitable for:

North and south bridge, cards, cell phone chip, video chip BGA solder, bumping

Also can use off the tin, the effect is very ideal

The residue was less bright spot, less smoke, no pungent odor, do not run the ball

Package included:

1 x 100g AMTECH NC-559-ASM BGA PCB SMT IC Reballing Soldering Paste Flux Grease