Professional 4-in-1 precision tool for glue removal. š¹ Removes black adhesive and edge glue š¹ High-carbon steel blades for durability š¹ Comfortable grip, corrosion-resistant finish š¹ UK Stock, fast delivery.
š¹ Full Description
The MaAnt MY-102 4 in 1 Underfill Glue & Edge Removal Set is designed for safe and precise adhesive removal around ICs, CPUs, NAND chips, and BGA packages.
It features a high-carbon spring steel blade that provides flexibility and long-lasting durability. The polished, vacuum-plated surface resists corrosion and heat, ensuring consistent performance even after repeated use.
This tool is perfect for removing underfill and edge glue from logic boards and components such as WiFi, baseband, and NAND without damaging nearby parts. Its ergonomic handle provides excellent control, making it suitable for both professional repair centres and advanced technicians.
š¹ Key Features
āļø 4-in-1 design for multiple adhesive removal applications
āļø High-carbon steel blade ā flexible, durable and corrosion-resistant
āļø Precisely shaped tips for accurate glue lifting and scraping
āļø Comfortable non-slip handle for precision control
āļø Safe for use on CPU, NAND, WiFi, and baseband chips
āļø Suitable for professional BGA and logic board repairs
š¹ Why Choose
āļø Professional-grade tool trusted in repair centres
āļø Designed for fine adhesive removal without board damage
āļø Long-lasting steel construction with anti-corrosion coating
āļø Multi-purpose design ā one tool covers four scraping functions
āļø UK Stock ā ready for fast dispatch
š¹ What You Will Receive
āļø 1 Ć MaAnt MY-102 4 in 1 BGA / CPU / IC Underfill Glue & Edge Removal Set
š¹ Please Note
šø Pictures shown are for illustration purposes only.
ā ļø Sharp blades ā handle with care during use.
ā ļø Use under magnification for precision and safety.
š¹ Delivery
āļø Fast & Free ā Royal Mail 48 (2ā5 days)
āļø Optional ā Royal Mail 24 (1ā3 days)