Features: This accuracy positioning module is specifically designed for S21 to S24 series, ensuring 1 1 alignment with chip solder points to boosts reballing success rates and efficiency, making it an essential reballing tool for professional repairs.
Featuring a modulars design with cut or machined stainless steel or alloy construction, it offer smooth, burr easy holes and optimized thickness for durability, resisting deformation over hundreds of uses as a stable accuracy positioning module.
Ideal for professional phone repair technicians and specialists who handle intricate chip rework on devices, this repair caters to experts demanding high accuracy tools for consistent results.
Use it in repair workshops for scenarios like CPU reballing, power IC replacement, or chip assembly on S21U to S24U models, ensuring physical hard positioning to prevent misalignment and enhances repair standards.
suitable for multiple and mainstream os systems device chips, this versatile tool supports interchangeable modules for long term cost savings and space efficiency, elevating repair quality while reducing rework risks.

Specifications: Component : metal
Size: about 106×85mm/4.17x3.54inch
Styles: multiple for option

Package Includes: 1xPositioning Plate

note: 1.Please allow 1-2cm errors due to manual measurement, make sure that you do not mind before you order.
2.Due to the difference between different monitors, the picture may not reflect the actual color of the item.