Product Technical Specifications
   
Part Status Active
Automotive No
PPAP No
Cell Type MLC NAND
Chip Density (bit) 64G
Architecture Sectored
Boot Block Yes
Number of Words 64G/16G/8G
Programmability Yes
Timing Type Synchronous
Maximum Erase Time (S) 0.02
Interface Type Serial e-MMC
ECC Support Yes
Support of Page Mode No
Mounting Surface Mount
Package Height 0.49
Package Width 11.5
Package Length 13
PCB changed 153
Standard Package Name BGA
Supplier Package FBGA
Pin Count 153
Lead Shape Ball
   
Standard Package 1,120
   
   

Attention:

   
    We supply original NEW products from famous manufacturers. After you receive the item,please use it in time. If you have any question,please contact us directly instead of opening CASE that brings us very bad effect and can't solve any problem.
    We already entered into Approved Vendor List of some OEM factories in China. We look forward to cooperating with you in mass production business in near future.


Company Profile of RACEA

    RACEA specializes in Electronic and Automotive solutions which are considered vital components to personal using and business application. The founder of RACEA has over 20 years of industry experience, with backgrounds in Fortune 500 Samsung and Panasonic, and is committed to providing high-quality and reasonably priced electronic and automotive parts to global users. RACEA Technology determines to become your valuable and reliable partner all along. Wish good cooperation between RACEA and you in future!