Pamięć Samsung K4G20325FC-HC04 GDDR5 The offered chip has undergone a manufacturer refurbishment process. Before shipment, we reball the component using new BGA balls, ensuring it is fully prepared for professional installation. Intended use: graphics cards and laptops BGA ball type: leaded Ball diameter: 0.45 mm Manufacturer: Samsung Semiconductor Memory type: GDDR5 SGRAM (Synchronous Graphics RAM) Single die capacity: 2 Gb (Gigabits), which when converted to bytes gives exactly 256 MB of capacity per chip. Memory organization: 64M x 32-bit (32-bit wide data bus per die, architecture based on 16 internal banks). Rated transfer speed (latency): The -HC04 pin means an access cycle time of 0.4 ns, which translates into an effective speed of up to 5.0 Gbps (actual clock frequency is 1250 MHz). Supply voltage: The rated supply voltage of the interface (POD_15) is 1.5 V (with a tolerance of ± 0.045V). Package type / Pinout: 170-ball FBGA (standard BGA package for GDDR5 with 170 pins). Silicon revision: "C-die" (marked with the letter "C" in the K4G20325F-C code, indicating an older technological process compared to the later "S-die" or "E-die" revisions) We are a professional company specializing in graphics card and motherboard repair for approximately 15 years! AMD HD 7670 https://upload.cdn.baselinker.com/products/4032108/ddfade15b0bce2e0d322d308f6b8c3ae.png