⚡ Fast Shipping • 3% Silver Enhanced Formula • Perfect for SMT & Micro-Soldering
Achieve flawless, professional-grade joints with our premium 3% silver-containing lead-free solder paste. Specially engineered for precision micro-electronics, mobile phone logic boards, SMD components, and circuit board repairs, this low-residue paste offers exceptional thermal and electrical conductivity. Packed in a convenient syringe-style needle tube applicator, it allows for pinpoint placement directly onto microscopic pads without wastage or bridging.
| Product Type: | Lead-Free Silver Solder Paste Flux (Syringe/Needle Type) |
| Alloy Composition: | Sn96.5 / Ag3.0 / Cu0.5 (Containing 3% Genuine Silver) |
| Melting & Reflow: | Melting Point: 217°C / Recommended Welding Temp: 255°C |
| Conductivity Rating: | Ultra-High Conductivity (Improved 30% Over Standard Non-Silver Paste) |
| Target Applications: | Smartphones, Audio Gear, PCB Motherboards, SMT/SMD Components, DIY Electronics |
To keep your soldering paste in optimal working condition during transit, all orders are carefully climate-sealed and sent with end-to-end tracking updates. Your expected delivery window is firmly within 7-10 business days.