KINGBO RMA-218 is a high-viscosity, no-clean flux paste specially formulated for professional rework and electronic assembly. Made in Japan, it is widely trusted for its performance in:
BGA reballing (holds solder balls firmly in place)
Attaching spheres or pins to BGA, CGA, and CSP packages
Flip-chip bonding to PCB substrates
This flux offers excellent adhesion, conductivity, and minimal residue—perfect for precision electronics repair.
Key Features:
No-clean, non-corrosive formula
High viscosity for accurate application
Genuine product – fully tested before shipping
Ideal for rework, soldering, and BGA reballing
Package Includes:
1x KINGBO RMA-218 Flux Paste (100g)
Note:
Please check the photos carefully before purchasing to avoid misunderstandings.