Items Descriptions Tin foil tin with indium 51 bismuth 32.5 tin 16.5 60 degrees indium-based solder
Solder sheet indium-based solder low temperature low melting point solder sheet tin foil tin strip indium 51 bismuth 32.5 tin 16.5 melting point 60 degrees
Indium bismuth tin alloy
Alloy composition: In51Bi32.5Sn16.5
Melting point: 60 degrees
Thickness: 0.05mm, 0.1mm, 0.15mm, 0.2mm, etc., the width can be customized
Indium based solder
Indium has a low melting point (157°C), and can form a series of low-melting eutectic solders with Sn, Pb, Ag and other elements, which can avoid the influence of high temperature factors on the product during the packaging and soldering process. High corrosion resistance, good wetting ability for both metals and non-metals, the formed solder joints have the advantages of low resistance and high plasticity, and can be used for matching packaging of materials with different thermal expansion coefficients. Therefore, indium-based solder is mainly used in the packaging of electric vacuum devices, glass, ceramics and low temperature superconducting devices. Pure indium and indium-based alloy solders have excellent thermal conductivity, low melting point, excellent softness and ductility, etc., and are often used as connecting materials and thermal conductive materials such as ceramic components lapped to PCBs.
Features:
Ultra Low Temperature Seal (Indium) Indium is an ideal material for many sealing applications, especially for ultra-low temperature sealing such as liquid nitrogen. There are two main benefits to using indium in cryogenic sealing: *Indium can maintain ductility and malleability at ultra-low temperature, and will not crack and break at low temperature of -150°C.
*Indium is soft and tough, and can fill the gap between the two metal surfaces to form a complete seal.
good physical properties
The solder joint has good fatigue resistance, mechanical strength, and reliable tensile strength. It has high corrosion resistance to alkaline and salt media, and is suitable for welding in chlor-alkali industrial equipment.
Good electrical and thermal conductivity
High electrical conductivity, indium-based solder has close to Sn-Pb alloy and higher electrical conductivity, which can avoid the loss of electrical signals on the solder joints and meet the requirements of electronic connections.
good compatibility
In the process of using indium-based solder, the copper, tin, silver, gold, nickel and other plating layers of PCB pads and component pin plating have good brazing performance. In addition, different types of fluxes are compatible.
prevent gold embrittlement
When soldering gold-plated products, if tin-based solder is used, the gold of the gold-plated components will be absorbed, and a brittle IMC metal compound will be formed. Therefore, in these cases, it is generally recommended to use indium-based solder, which can prevent the loss and penetration of gold. Enhanced solder joint reliability.
Good matching performance with non-metals
It has an expansion coefficient similar to that of non-metals such as quartz and ceramics, so it is often used in the welding of glass products, ceramic products, quartz products, ceramic products, etc. in electronics, low-temperature physics, and vacuum systems.