Intel Core i7-870 CPU Quad-Core 2.93 GHz 8M SLBJG LGA 1156 95W Processors

Product Description

General information
Type CPU / Microprocessor
Market segment Desktop
Family
Model number  ? 
CPU part numbers
  • BV80605001905AI is an OEM/tray microprocessor
  • BX80605I7870 is a boxed processor with fan and heatsink (English version)
  • BXC80605I7870 is a boxed processor with fan and heatsink (Chinese version)
Frequency  ?  2933 MHz
Maximum turbo frequency
3600 MHz (1 core)
3467 MHz (2 cores)
3200 MHz (3 or 4 cores)
Bus speed  ?  2.5 GT/s DMI
Clock multiplier  ?  22
Package 1156-land Flip-Chip Land Grid Array (FC-LGA8)
Socket Socket 1156 / H1 / LGA1156
Size 1.48" x 1.48" / 3.75cm x 3.75cm
Weight 0.9oz / 24.8g
Introduction date Sep 8, 2009
End-of-Life date
Last order date is June 29, 2012
Last shipment date for tray processors is December 7, 2012
Price at introduction $562
S-spec numbers
Part number ES/QS processors Production processors
  Q3AJ SLBJG
BV80605001905AI + +
BX80605I7870   +
BXC80605I7870   +
Architecture / Microarchitecture
Microarchitecture Nehalem
Processor core  ?  Lynnfield
Core stepping  ?  B1 (Q3AJ, SLBJG)
CPUID 106E5 (SLBJG)
Manufacturing process
0.045 micron
774 million transistors
Die 296mm2
Data width 64 bit
The number of CPU cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size  ? 
4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size  ?  4 x 256 KB 8-way set associative caches
Level 3 cache size 8 MB 16-way set associative shared cache
Physical memory 16 GB
Multiprocessing Uniprocessor
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 
  • EM64T / Extended Memory 64 technology / Intel 64  ? 
  • HT / Hyper-Threading technology  ? 
  • VT-x / Virtualization technology  ? 
  • VT-d / Virtualization for directed I/O
  • NX / XD / Execute disable bit  ? 
  • TXT / Trusted Execution technology
  • TBT / Turbo Boost technology  ? 
Low power features
  • Thread C1/C1E, C3 and C6 states
  • Core C1/C1E, C3 and C6 states
  • Package C1/C1E, C3 and C6 states
  • Enhanced SpeedStep technology  ? 
Integrated peripherals / components
Integrated graphics None
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
Other peripherals
  • Direct Media Interface
  • PCI Express 2.0 interface
Electrical / Thermal parameters
V core  ?  0.65V - 1.4V
Minimum/Maximum operating temperature  ?  5°C - 72.7°C
Maximum power dissipation  ? 
189.78 Watt (peak)
160.08 Watt (sustained)
Thermal Design Power  ?  95 Watt

Package Include：

1 * CPU.

In 100% working order. Photo above is only for illustration purposes. 
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