BGA Rework Station Hot Air Infrared Three Temperature Zone Desoldering Station

Dimensions: Length 400mm x Width 380mm x Height 450mm
Power Supply: 220V 50Hz
Upper Heating: 800W Bottom Preheating: 1600W
Third Zone: 400W
Machine Power: 2800W
Machine Weight: 18 kg


Performance Specifications:
This repair station is specifically designed for the repair of laptop motherboards and desktop computer motherboards, custom-made for optimal performance.
It comes with a complete set of soldering techniques, experience-based tips, and solutions (specifically tailored for laptop motherboards and desktop computer motherboards). This repair station features an optimized heating temperature sequence, eliminating the need for ordinary users to manually set segmented heating temperatures, thereby ensuring a higher soldering success rate and completely preventing inexperienced users from accidentally damaging the circuit board. This repair station features an innovative design that allows for convenient operation without connecting to a computer. This repair station can repair various CPU sockets. This repair station can replace various slots. This repair station can reliably replace dual-layer BGA chips, and no solder paste will leak between the dual-layer BGA chips after replacement.
After heating the solder ball stencil, the stencil remains undistorted (suitable for users who prefer to heat the stencil directly).
This rework station can perform PCB drying and PCB shaping. The PCB clamping frame of this rework station is a highly practical universal sliding table type, enabling it to securely clamp any complex PCB structure flatly and ensure no deformation.