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For BGA Reballing Kit for Android Devices from For Samsung and For Huawei
DESCRIPTION


Product description:

 

and

Made of - materials,

These 3 for BGA template tin plates are used for Samsung for android for android MTK series chip IC plant tin repair



Package Contents:


1 *for BGA pressure welding steel plate for S5026 48 in 1 for Samsung

1 *for BGA pressure welding for mold for A418 for Samsung for HTC for Huawei for android MTK

1 *for BGA pressure welding template for A90 MTK series




Note:

1. The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.

2. Please allow slight manual measurement deviation for the data.

POLICES

 

We only ship to confirmed ebay Order addresses. Please comfirm that your Order address is in line with your shipping address.

 

Please kindly note that the combined shipping is not provided because the shipping fee is calculated by weight. Also, the each additional item means exactly the the same color and size. 

 

It takes about 7-15 working days to US; about 10-30 working days to other countries. Transit time may be a little delayed because of the bad weather and customs inspection. If you do not receive your item within 30 working days since payment finished, please contact us immediately for further assistance.

 



Payment must be completed within 5 days. If you have any problems about payment, please contact us via ebay message.

 

We strive for 100% customer satisfaction! Positive Feedback is very important to us. If you have any questions, please feel free to contact us via "Ask seller a question" . We will reply your email within 24 working hours.