Product Description
 
Polysynthetic silver thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.
Weight: 6.0g/tube
Operation Temperature: -50/280°c
Thermal Conductivity: >3.17W/m.k, Thermal Resistance: <0.067°c-in2/w
20% metal oxide compounds
 


On 31-Jul-2025 at 11:23:53 BST, seller added the following information:

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