Product Details
Features:
1. Using high-quality materials, the quality is guaranteed
2. The module performance is stable
3. Measuring range -100-0KPa
4. Suitable for non-corrosive gases
5. Wide range of applications
1. Using high-quality materials, the quality is guaranteed
2. The module performance is stable
3. Measuring range -100-0KPa
4. Suitable for non-corrosive gases
5. Wide range of applications
Parameter:
Output signal: 0.2~2.7 (3.3V power supply)
Accuracy: ±1.0, ±0.5, ±2.5
Long-term stability (1 year): ±0.5
Compensation temperature: 0~60℃
Measuring medium temperature: -10~85℃
Storage temperature: -40~150℃
Output signal: 0.2~2.7 (3.3V power supply)
Accuracy: ±1.0, ±0.5, ±2.5
Long-term stability (1 year): ±0.5
Compensation temperature: 0~60℃
Measuring medium temperature: -10~85℃
Storage temperature: -40~150℃
Installation tips:
1. Select the hose with the appropriate specification (inner diameter 2.5MMI) and strength
2. If necessary, use clamps to fix the hose (pressure≥500kPa)
3. Do not block the air intake
4. Avoid excessive external force operation
Note: Do anti-static protection during the soldering process, otherwise it is very likely to burn the circuit chip
1. Select the hose with the appropriate specification (inner diameter 2.5MMI) and strength
2. If necessary, use clamps to fix the hose (pressure≥500kPa)
3. Do not block the air intake
4. Avoid excessive external force operation
Note: Do anti-static protection during the soldering process, otherwise it is very likely to burn the circuit chip
1. Welding
Since this product has a small structure with a small thermal capacity, please minimize the influence of external heat, otherwise it may be damaged due to thermal deformation, resulting in changes in characteristics. Please use non-corrosive rosin type flux. Also, since the product is exposed, be careful not to allow flux to penetrate inside.
1) Hand welding
・Please use an electric soldering iron with a head temperature of 260 ~ 300 ℃ (30 w)) within 5 seconds.・In the case of soldering with a load applied to the terminals, the output may change. Please be careful. ·Please clean the tip of the soldering iron thoroughly.
2) DIP soldering (DIP terminal type)
- Work within 5 seconds in a DIP solder bath with a temperature of 260°C or lower.・When mounting on a board with a small thermal capacity. Avoid DIP soldering because thermal deformation may occur.
3) For the correction of the welding part, please complete the correction at one time.
When correcting lap soldering, use a soldering iron with a smooth head shape, and do not apply additional flux. Regarding the temperature of the tip of the soldering iron, please use the soldering iron below the temperature stated in the specification.
4) When excessive force is applied to the terminal, it will cause deformation and impair the solderability, so please avoid dropping the product or performing complicated use.
5) The warpage of the printed board should be kept below 0.05mm relative to the entire sensor, please manage this.
6) After installing the sensor, when cutting and bending the board, be careful not to apply stress to the soldered part.
7) Since the terminals of the sensor are exposed, an output abnormality may occur if the terminals are touched by a metal piece or the like. Be careful not to touch it with metal pieces or hands.
8) After soldering, when coating is applied to prevent deterioration of the insulation of the substrate, be careful not to attach chemicals to the sensor surface.
Since this product has a small structure with a small thermal capacity, please minimize the influence of external heat, otherwise it may be damaged due to thermal deformation, resulting in changes in characteristics. Please use non-corrosive rosin type flux. Also, since the product is exposed, be careful not to allow flux to penetrate inside.
1) Hand welding
・Please use an electric soldering iron with a head temperature of 260 ~ 300 ℃ (30 w)) within 5 seconds.・In the case of soldering with a load applied to the terminals, the output may change. Please be careful. ·Please clean the tip of the soldering iron thoroughly.
2) DIP soldering (DIP terminal type)
- Work within 5 seconds in a DIP solder bath with a temperature of 260°C or lower.・When mounting on a board with a small thermal capacity. Avoid DIP soldering because thermal deformation may occur.
3) For the correction of the welding part, please complete the correction at one time.
When correcting lap soldering, use a soldering iron with a smooth head shape, and do not apply additional flux. Regarding the temperature of the tip of the soldering iron, please use the soldering iron below the temperature stated in the specification.
4) When excessive force is applied to the terminal, it will cause deformation and impair the solderability, so please avoid dropping the product or performing complicated use.
5) The warpage of the printed board should be kept below 0.05mm relative to the entire sensor, please manage this.
6) After installing the sensor, when cutting and bending the board, be careful not to apply stress to the soldered part.
7) Since the terminals of the sensor are exposed, an output abnormality may occur if the terminals are touched by a metal piece or the like. Be careful not to touch it with metal pieces or hands.
8) After soldering, when coating is applied to prevent deterioration of the insulation of the substrate, be careful not to attach chemicals to the sensor surface.
2. Cleaning
1) Since the product is an open type, be careful not to allow cleaning fluid to penetrate inside.
2) When cleaning with ultrasonic waves, the product may malfunction, so please avoid cleaning with ultrasonic waves.
1) Since the product is an open type, be careful not to allow cleaning fluid to penetrate inside.
2) When cleaning with ultrasonic waves, the product may malfunction, so please avoid cleaning with ultrasonic waves.
3. Environment
1) Please avoid use and storage in places where there are corrosive gases (organic solvent gas, sulfurous acid gas, hydrogen sulfide gas, etc.) that have a bad influence on the product.
2) This product is not drip-proof, so do not use it in places where it may be splashed with water, etc.
3) Do not use it in an environment where condensation occurs. In addition, when the moisture adhering to the sensor chip freezes, the sensor output may fluctuate or be destroyed.
4) When the chip of the pressure sensor is structurally exposed to light, the output will change. Especially when applying pressure through a transparent cover, etc., avoid letting the light touch the sensor's chip.
5) Please avoid using methods that apply high-frequency vibration such as ultrasonic waves.
1) Please avoid use and storage in places where there are corrosive gases (organic solvent gas, sulfurous acid gas, hydrogen sulfide gas, etc.) that have a bad influence on the product.
2) This product is not drip-proof, so do not use it in places where it may be splashed with water, etc.
3) Do not use it in an environment where condensation occurs. In addition, when the moisture adhering to the sensor chip freezes, the sensor output may fluctuate or be destroyed.
4) When the chip of the pressure sensor is structurally exposed to light, the output will change. Especially when applying pressure through a transparent cover, etc., avoid letting the light touch the sensor's chip.
5) Please avoid using methods that apply high-frequency vibration such as ultrasonic waves.
Package list:
Pressure sensor module* 1
Pressure sensor module* 1
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