Tflex™ HR600 is a cost-effective and compliant gap filler thermal interface material with
excellent thermal performance and great handling for mass-production applications.
The low modulus interface pad conforms to component topography, resulting in little stress
on the components, mating chassis or parts. The softness relieves mechanical stress from
high stack-up tolerance and absorbs shock, resulting in improved device reliability. Tflex
HR600’s recovery properties for applications requiring material rework result in continued
mechanical integrity even after device rework and re-assembly.
Tflex HR600 is naturally tacky on both sides and requires no additional adhesive coating to
inhibit thermal performance. The tack is designed to hold the pad in place during
assembly and component transport.
Tflex HR600 is electrically insulating, stable from -45ºC thru 200ºC, and meets UL 94V0
flame rating.