FEATURES

1. Compact with high sensitivity The high-efficiency polarized

electromagnetic circuits of the 4-gap balanced armature and our exclusive

spring alignment method achieves, with high-sensitivity in a small

package, a relay that can be directly controlled by a driver chip.

2. Strong resistance to vibration and shock

Use of 4G-BA technology realizes strong 

resistance to vibration and shock.

3. High reliability and long life Our application of 4G-BA technology,

along with almost perfectly complete twin contact, ensures minimal contact

bounce and high reliability.

4. Ability to provide wide-ranging control

Use of 4G-BA technology with goldclad silver alloy contacts 

in a twin contact structure enables control across a broad range from

microcurrents of 100 uA 100 mV DC to 4 A 250 V AC.

5. Latching types available With 4G-BA technology, as well as

single side stable types, convenient 2 coil latching types for circuit memory

applications are also available.

6. Wide variety of contact formations available

The compact size of the 4G-BA mechanism enables the provision of

many kinds of package, including 2a2b, 3a1b, and 4a. These meet your

needs across a broad range ofapplications.

7. Low thermal electromotive force relay

High sensitivity (low power consumption) is realized by 4G-BA

technology. Separation of the coil and spring sections has resulted in a relay

with extremely low levels of thermal electromotive force (approx. 0.3 uV).

8. DIL terminal array Deployed to fit a 2.54 mm .100 inch

grid, the terminals are presented in DIL arrays which match the printed circuit

board terminal patterns commonly in international use.

9. Relays that push the boundaries of relay efficiency

High-density S relays take you close to the limits of relay efficiency