16 Precise Ultra-Thin Working Tips • Stainless Steel • Anti-Slip Knurled Grips
Equip your micro-soldering bench with this professional 8-piece double-ended CPU IC glue remover pry knife set, featuring precise ultra-thin stainless steel blades and anti-slip knurled handles designed for safe, high-precision removal of black UV glue, thermal epoxy, and CPU/NAND/BGA chips during mobile phone, tablet, and computer circuit board repairs.
Each double-ended tool offers unique thin pry heads, curved scrapers, flat spatulas, and hook tips for delicate prying, scraping, lifting, and cleaning operations.
Specialized ultra-thin blade profiles slip under fine BGA IC chips, NAND flash memory, and phone CPUs without damaging fragile PCB board pads.
Built from premium heat-resistant stainless steel to resist wear, corrosion, and bending while withstanding high rework temperatures near heat guns.
Features textured cross-hatch knurling along each handle segment to provide maximum control and finger stability during high-precision repair tasks.
Lightweight design includes a transparent protective organizer pouch for convenient workbench storage and easy transport in field technician toolkits.
Ideal for repairing cell phones, tablets, laptops, gaming consoles, desktop motherboard ICs, and small household electronics.
| Feature / Attribute | Imperial / American Standard | International Metric Units |
|---|---|---|
| Product Category | IC Chip Glue Remover Pry Knife Set | IC Chip Glue Remover Pry Knife Set |
| Total Tool Count | 8 Double-Ended Tools (16 Working Tips) | 8 Double-Ended Tools (16 Working Tips) |
| Single Tool Overall Length | Approx. 6.85 in | Approx. 174 mm (17.4 cm) |
| Package Pouch Length | 8.94 in | 22.7 cm (227 mm) |
| Package Pouch Width | 2.01 in | 5.1 cm (51 mm) |
| Primary Material | Premium Stainless Steel | Premium Stainless Steel |
| Handle Style | Textured Anti-Slip Knurled Grip | Textured Anti-Slip Knurled Grip |
| Tool Finish | Silver Metallic Polish | Silver Metallic Polish |
| Primary Applications | BGA Glue Removal, CPU/NAND Chip Prying | BGA Glue Removal, CPU/NAND Chip Prying |
| Compatible Devices | Mobile Phones, Tablets, PCs, Laptops | Mobile Phones, Tablets, PCs, Laptops |
| Net Weight (Set of 8) | Approx. 1.85 oz - 2.20 oz | Approx. 52.4 g - 62.3 g |
| Brand Designation | Unbranded | Unbranded |
| Condition | 100% Brand New | 100% Brand New |
| Country of Origin | China | China |
Package includes: 1 Set of 8 Double-Ended Stainless Steel CPU IC Glue Remover Tools in a protective pouch.
Sizing & Dimension Notice: Please verify tool and package sizing before ordering. Allow a minor manual measurement tolerance of 0.04 in - 0.12 in (1.0 mm - 3.0 mm). Single Tool Length: Approx. 6.85 in (174 mm); Sealed Package Dimensions: 8.94 in × 2.01 in (22.7 cm × 5.1 cm).
Display & Color Variance Notice: Studio camera lighting during photography and individual screen settings may cause minor color shade differences between metallic silver tools and online photos.
Adhesion & Workbench Mounting Recommendation: Tools are supplied in a clear pouch. For custom workbench display or magnetic tool strip mounting, users may optionally secure storage clips using double-sided tape or hot glue.
Unit Conversions: 1 in = 2.54 cm / 1 cm = 0.39 in / 1 mm = 0.039 in / 1 lb = 0.453 kg / 1 oz = 28.35 g.
Follow these essential steps for effective, safe BGA chip glue removal:
1. Board Preparation: Apply appropriate heat (via hot air rework station) to soften thermal epoxy or black UV glue surrounding the IC chip or CPU.
2. Blade Selection: Select the corresponding thin blade or hook shape that best fits beneath the chip edges or around component glue lines.
3. Prying & Cleaning: Gently slide the ultra-thin tip under the chip corner to lift and scrape away softened adhesive without applying force to underlying PCB copper pads.