ReLife RL-420-UV — 10cc rosin BGA flux paste for chip-level repair. 🔹 Lead-Free 🔹 Low Smoke 🔹 High Insulation Resistance 🔹 UK Stock – Fast Dispatch
The ReLife RL-420-UV is a lead-free rosin flux paste for BGA reballing, SMD soldering, and chip-level PCB repair.
It is formulated for iPhone, Android, and tablet motherboard rework, including logic board and mainboard repair.
The imported rosin base gives a dark brown paste with fast, clean tinning and minimal smoke during use.
High insulation resistance and an impurity-free consistency support reliable SMD rework and CPU rework tasks.
Supplied in a 10cc syringe with needle and push rod for controlled, precise application during BGA, PGA, and SMD soldering workflows.
The syringe format reduces waste and supports repeated use across multiple microsoldering and rework sessions.
It works well with reflow, hot air rework, and standard soldering iron techniques for bench-level chip-level repair.
Suited to BGA reballing and SMD rework on PCB and logic board repair projects.
✔️ ReLife RL-420-UV — rosin BGA flux paste in a 10cc syringe format
✔️ Lead-free imported rosin base for fast, clean tinning and minimal smoke
✔️ High insulation resistance for reliable SMD rework and CPU rework
✔️ Suited to BGA reballing, PGA soldering, and chip-level PCB repair
✔️ Compatible with iPhone, Android, and tablet motherboard microsoldering
✔️ 1 x ReLife RL-420-UV 10cc BGA Flux Paste Syringe
✔️ Fast & Free – Royal Mail 48 (2–3 working days)
✔️ Optional Upgrade – Royal Mail 24 (1–2 working days)
✔️ Other Options – Royal Mail 1st & 2nd Class Signed For