New and Upgraded High-Speed BGA Chip Placement Station | Solder Ball BGA Repair | BGA Ball Placement Station Alignment

Features:

1. Features an aluminum alloy frame for a lightweight yet durable structure.

2. This model includes an automatic centering function. By rotating the spindle, the four positioning holes align the chip, and the four clamping blocks secure it simultaneously. This eliminates the need for individual adjustments, ensuring precise positioning, fast clamping, and high ball placement efficiency.

3. When used with different stencils, this ball placement station can accommodate BGAs of various sizes. It supports chips as large as 45 x 45 mm and as small as 4 x 4 mm, and is compatible with both 80 x 80 mm and 90 x 90 mm stencils. It offers two positioning methods: magnetic stencils and manual screw-adjustable stencils, and comes with an L-shaped Allen wrench. It delivers high productivity and is suitable for a wide range of applications.