SEMIXICON DIASEMI Diamond Copper Composite 

SEMIXICON DIASEMI ø5x2.5 diamond  Copper Diamond Composite Heatsink Spreader

Density:    6 g/cm3

Thermal Conductivity: 750-800W/mk

Thermal expansion :   6.8ppm/K

Surface roughness: <0.5um

Flatness: <30um

Price is for one 

Same day free shipping USA 

Please check with us other sizes such as 15x15,20x20,25x25 up to 150x150 ,square ,round in most of cases in 

DIASEMI SEMIXICON Fremont CA  warehouse

Diasemi ----Diamond Semiconductor 

www diasemi US

Semiconductor, Electronics, Medical, Photonics ,Laser, Aerospace

SEMIXICON DIASEMI