Comsol™ Solda -Met 5LS is a high melting point (296°C) silver-tin-lead soft solder. It can be supplied as a solid wire, as a flux cored wire with rosin, synthetic resin or acid type fluxes and as a specially formulated solder paste. The principal characteristic of Comsol™ is that it offers an improvement in creep resistance in comparison with standard tin-lead type soft solders, both at normal and at elevated temperatures. For example, at 150°C a 50-50 tin-lead solder (JM5050) will fail under a load of 0.7 N/mm² in approximately 10 hours. Comsol™, however, shows no creep at the same temperature. Tests undertaken by Johnson Matthey show that at greater loads of 1.7 and 3.5 N/mm² Comsol™ takes 1 year and 250 hours respectively to fail. The high melting point of this solder also makes it useful in step soldering operations. Due to its tin content Comsol™ shows improved wetting and flow on copper and copper alloys compared with silver-lead soft soldering alloys such as Johnson Matthey A25™ and A5™. The optimum joint gap for Comsol™ is 0.075mm. Composition: 1.5% Silver, 5% Tin, 93.5% Lead Specification: EN ISO 9453:2006 Alloy No. 191, formerly EN 29453 No34 MS99 9500/145

Melting Range 296 C