Professional, high-density 6-block passive heatsink assembly suitable for server CPU or GPU cooling. Constructed from aluminium with stacked fin arrays and screw-mounted joins. Designed for multi-socket Intel Xeon Scalable platforms using the LGA 3647 mounting pattern (90 mm square pitch). Grade A.

Key Features

Technical Specifications

Specification Details
Brand Unbranded
Model Not specified
Part Number Not specified
Type Passive finned heatsink assembly (multi-block)
Socket compatibility Intel LGA 3647 (Xeon Scalable)
Material Aluminium (finned blocks)
Mounting pitch 90 mm square
Number of blocks 6 (arranged 3 x 2)
Block dimensions (W × L × H) 90 × 90 × 25 mm (per block)
Colour Silver
Intended use Server CPU/GPU cooling in multi-socket enterprise systems
Country of origin China
Manufacturer warranty None
Unit quantity 1
Packaging Not specified

What you get

History

Removed during an IT decommissioning project; item was taken from a working environment and is sold as a surplus server component.

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Returns

Please review the listing details and photos carefully before purchase. If you have any questions, contact us before ordering.