Thermal conductive silicone filler pad 3.15 W/mK in 0.8mm,1mm,2mm and 3mm thick

• All our parts are stocked in Melbourne
• Extremely soft, 12 shore 00, yet maintains a high thermal Conductivity of 3.15W/m.k, It is the ideal material in situations where a great deal of heat needs to be conducted away from small electronic components. The material can mould it self to different component shapes, gaps and uneven surfaces. Also the material offers low heat resistance; this particular property is reduced as the product?s thickness is decreased.
• High thermal conductivity of 3.15 (W/m-K)
• Very soft, gap filler, adapts to different component shapes
• Highly soft thermal conductive silicone pad 
• Suitable for high power semiconductor module applications.
• Ceramic filled silicone
• Hardness: Shore 20 (shore 00 scale)
• Thermal Conductivity: 3.15W.m/K
• Elongation: 410.38 (%)
• Tensile strength: (Psi) 21.66
• Insulation strength; ( kV / mm) 1
• Operating Temperature: -40 to 200°C 
• Flammability: V-0
• Specific gravity g/cm3: 2.11 
• RoHS compliant
• Grey colour
• Available in 0.8 ,1,2 & 3mm