Thermal conductive filler pad 6 W/mK
  • Whats in the pack: 1pc thermal pad 100*100*1.0mm
  • Extremely high thermal conductivity of 6 (W/m-K)
  • Medium soft, gap filler, excellent heat dissipation whilst minimising heat resistance. 
  • Ceramic filled silicone
  • Suitable for high power semiconductor module applications.
  • Thermal Conductivity 6W.m/K
  • Elongation: % 99
  • Tensile strength: (Psi) 64
  • -40 to 200°C Operating Temperature
  • Flammability: UL94 V-O 
  • Specific gravity g/cm3: 2.46   
  • Insulation strength kV / mm: >10
  • RoHS compliant
  • Grey colour
  • Also available in 0.5 and 2mm