GD900 Thermal Paste - 5 x 0.5g Single-Use Packets

***PLEASE READ***

FREE SHIPPING via USPS First Class letter mail. Please note, there is no tracking for this option. You have the option of selecting USPS Ground Advantage or USPS Priority Mail at checkout if you require a tracking number.

Product Description

High-performance thermal compound designed for efficient heat transfer between a heat source and a heatsink. This listing is for a pack of five (5) single-use 0.5 gram packets. Suitable for use on CPUs, GPUs, LEDs, and other electronic components.

Key Specifications

• Thermal Conductivity: 4.8 W/m-K
• Specific Gravity: 2.3 g/cm³
• Working Temperature: -50°C to 200°C (-58°F to 392°F)
• Color: Gray

Material Properties

• Composition: A silicone-based compound with oxidized metal as the primary raw material.
• Electrical Properties: Electrically non-conductive and high insulation.
• Corrosive Properties: Non-corrosive, does not damage copper, aluminum, or steel surfaces.
• Environmental Compliance: Accordance with RoHS and REACH environmental protection requirements.

The paste is designed to fill microscopic imperfections and air gaps between a component and a heatsink, maximizing the contact area to improve thermal dissipation.