Raychem TE Connectivity SCL is designed to provide one-step moisture-proof encapsulation of a wide variety of electrical parts including wire splices, breakouts, and electronic components. The encapsulant melts and flows to fill surface irregularities of the substrate.
Encapsulates components, splices, and terminations where moisture resistance and mechanical protection are required. The encapsulant melts and flows to fill surface irregularities of the substrate. While still hot, the tubing can be blocked to form a wire breakout.
Manufactured from radiation cross-linked polyolefins, SCL has an inner wall, which melts at 100°C, and is forced into the crevices and interstices by the shrinking action of the outer tubing. When cooled, the entire mass becomes a rigid, tough, homogeneous covering with controlled wall thickness. SCL shrinks between 17% and 40% of its supplied diameter according to size and therefore few sizes are required to cover a range of irregular shapes with widely varying dimensions.
