High viscosity, hand moldable compound for water cooling plates, desktop GPUs and high power consoles; 16.8 W/m·K*; engineered for wide tolerances where paste can’t maintain contact.

Description:
UPSIREN UX PRO Ultra 100g is a high capacity supply of our most conductive non-electrically conductive thermal putty, built for large tolerance assemblies such as water cooling blocks, desktop GPUs and next-gen consoles. It establishes robust contact across uneven, millimeter-scale gaps around GDDR6/GDDR6X VRAM and VRM stages, delivering stable thermal paths during long, heavy workloads.

The 100 g jar provides economical coverage for labs, refurbishers and power users who service multiple devices in succession. Decant small portions into cups for microscope work, keep the main jar sealed between jobs, and maintain consistent texture across long projects.

In watercooled builds and other big coolers, cold plates rarely land flat across complex component clusters; standard paste is too thin to bridge those tolerances. UX PRO Ultra holds a uniform 2–4 mm layer that stays cohesive under clamp force, so your loop’s capacity translates to real temperature reductions where it counts.

The compound is more viscous and lightly tacky by design, making it easy to shape by hand for precise placement. Form a ribbon or pad with the included sleeves, set it on the components, and press for a clean, even footprint. Once installed, it resists pumpout and creep under sustained heat. Produced in Thessaloniki, Greece (European Union). The formulation was developed through scientific research cofunded by Greece and the European Union.

Packet includes:
• 1 × 100 g jar of UPSIREN UX PRO Ultra thermal putty
• 1 × plastic spatula
• 2 × protective finger sleeves

*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).

Bullets:
• Purpose-built for large tolerances: forms a cohesive 2–4 mm interface under clamp pressure where ordinary paste collapses, improving contact over GDDR6/GDDR6X VRAM, VRM stages and controllers.
• High viscosity, hand moldable formulation for precise placement; holds shape during assembly, resists pumpout through long gaming, rendering, mining and AI workloads.
• Maximum possible thermal conductivity for a nonconductive putty (16.8 W/m·K*), combining high heat transfer with electrical safety near dense SMD layouts and vias.
• Bulk 100 g capacity supports multidevice projects and production benches; decant working amounts to minimize exposure and keep the main jar sealed and clean between sessions.
• Ideal for water cooling cold plates and big air coolers alike—bridges uneven footprints, standoffs and frame edges without resorting to stacked pads that compromise uniformity.
• UPSIREN UX PRO Ultra is compatible with PlayStation 5, Xbox Series X, NVIDIA GeForce RTX 3080/3090/4080/4090 graphics boards, AMD Radeon RX 6800/6900/7900 series, and other systems using thermal pads or putties.

Tags: thermal putty; bulk jar; water cooling; nonconductive

Keywords: UPSIREN UX PRO Ultra, bulk thermal putty, 16.8 W/m·K*, nonconductive TIM, water cooling contact, cold plate gaps, 2–4 mm interface, desktop GPU, PS5 compatible, RTX 4080, RTX 4090, GDDR6X, VRM power stages, pumpout resistance, hand moldable, refurbishing, production bench, consistent texture, Thessaloniki EU, research funded