Low viscosity gel that liquefies under heat and wicks beneath components, turning clear for visual alignment. Supports BGA rework when needed, while excelling in everyday SMD microsoldering—connectors, QFN/DFN, jumpers, and fine-pitch pads—with precise, lowpressure dosing.

CS FLUX 10g (2x5g) is a halogen-free, lead-free, no-clean (meaning that any remaining CS FLUX will not be corrosive to the PCB and does not need to be cleaned) flux formulated for modern board repair where control and visibility matter. At room temperature it behaves as a soft gel for accurate placement. Under heat it becomes highly fluid, spreads uniformly, and turns transparent so you can track wetting and alignment under a microscope. It supports BGA rework and reballing when the job requires it, but its real strength is in routine microsoldering: replacing USB-C and HDMI ports, reattaching fine-pitch SMD controllers, drag soldering pin headers, laying jumper wires over interrupted traces, and refreshing oxidized pads on compact logic boards. CS FLUX is formulated as a soft gel at room temperature, making it easy to dispense directly from the applicator tube without special tools. The user can apply the exact quantity needed with simple finger pressure, ensuring precision and control in every application. In contrast, many other fluxes are so thick that they require dedicated equipment such as pneumatic pumps to be squeezed out, making CS FLUX a far more practical and user-friendly choice for both professionals and DIY users. The gel’s light tack helps hold small parts and solder balls in place before heating, while the low-residue chemistry keeps postwork cleanup minimal. Even users with limited soldering experience can achieve cleaner, more repeatable joints that resemble the work of experienced technicians. Store sealed, away from heat and sunlight; for extended stability, keep in a cool, dry place.

Packet includes:
• 2 × 5 g applicator tube of CS FLUX
• 2 × 1.6 mm precision application tip

Bullets:
• Turns transparent as it reaches working temperature, letting you see pads, fillets, and lead outlines clearly under the microscope so you can confirm wetting, detect bridges early, and guide the iron or hot air nozzle with confidence during delicate SMD work.
• Liquefies and wicks under parts during heating for uniform pad activation; ideal for reattaching fine-pitch ICs (QFN/DFN, SOIC, TQFP), refreshing oxidized pads, and stabilizing drag solder passes on dense connectors without drowning the area in excess flux.
• Soft, lightly tacky gel at room temperature helps “stage” components, jumpers, or stencil spheres before heat; once hot, viscosity drops dramatically to minimize part drift and promote even solder flow across arrays, headers, and shield frames.
• no-clean, halogen-free, lead-free formulation engineered for electronics repair; residue is thin and localized, and when inspection or conformal coating is planned, it can be wiped with high-purity isopropyl alcohol without aggressive scrubbing.
• Practical for DIY benches and professional stations alike: precise, low-pressure dosing from the included 1.6 mm tip means a tiny amount covers a large footprint, reducing mess, improving repeatability, and keeping neighboring components visible.
• Versatile across hot air, IR plate, and iron-only work flows: supports BGA rework when required, but shines in everyday repairs such as USBC/HDMI/DC jack replacements, sensor and button boards, WiFi modules, and micro connector rows on compact devices.