2pc Large Fin Heat Sink CPU Cooling IC Made Of Micro Porous Ceramic Up To 10W

Australia stock !

Micro porous ceramic heat sink for compact and slim electronic products

Moves heat by air circulation (without external force). Micro-porous nature, these heat sinks provide up to 30% more surface area compared to traditional heat sinks for highly efficient heat dissipation. Ceramic heat sinks are now adopted by IC of power under 10W. ROHS and REACH compliant green material

- Non electrically conductive, no antennae effect
- Not affected by humidity and dust
- Light weight,long life span, simple assembly process
- Thermally conductive adhesive tape with pull tab for direct IC surface mount
- Power dissipation of up to 10W

Sizes we stock are: 

Flat 2.5*15*15mm, 2.5*22*22mm, 2.5*30*30mm

Fin 5*25*25mm, 5*30*30mm, 5*40*40mm, 10.25*50*50mm

We also stock heat pipes made of aluminum and thermal pads