Feature: 1. Thermal Column Design: The top cover of this passive cooling enclosure is designed with a thermal column to achieve overall heat dissipation through thermal adhesive and chip bonding, allowing for more stable performance and fast thermal conductivity. Specification: Item Type: Passive Cooling Case Package List:
3 x Housing 1 x Pin Header 8 x Screw 8 x Nut 4 x Plastic Ring 2 x Sticker |