Heatsink – Pure Copper with Folded Fin Design

• Material: Entirely constructed from pure copper for superior thermal conductivity. Features a folded fin design to maximize surface area and enhance heat dissipation.

• Dimensions: 3.27" (L) x 2.64" (W) x 1.77" (H)

• Weight: 1.2 lbs

• Thermal Interface Material: Includes Shin-Etsu 7783W high-performance thermal grease for optimal contact and heat transfer.

Ideal for high-performance cooling in compact electronic systems or demanding thermal environments.