Processor Specifications
SoC: Rockchip RK3566
CPU: Quad-core Arm Cortex-A55 (64-bit) at up to 2.0 GHz
GPU: Arm Mali-G52-2EE (supporting OpenGL ES, Vulkan 1.1, OpenCL 2.1)
NPU: 0.8 TOPS for deep learning/AI acceleration
Brand |
Okdo |
|
Product Name |
ROCK 3 Compute Module SODIMM (CM3 SODIMM) Model A 2GB/32GB / Wi-Fi/BT |
|
Product Type |
ROCK SBC Board |
|
RAM Size |
2GB |
|
Port Connections |
Up to 60X Gpio |
|
Operating System |
Android 10/12, Ubuunt LINUX |
|
Video Resolution |
4K pixels |
The OKdo ROCK 3 Compute Module SODIMM (CM3S) Model A is a highly impressive device that offers an array of features within its compact design. It’s based on the Rockchip RK3566 System on Chip (SoC), which boasts a robust quad-core ARM Cortex-A55 processor, a Power Management Unit (PMU), DRAM memory, eMMC storage, as well as wireless connectivity through WiFi 4 and BT 4.2. All these components are packed into a compact DDR2 SODIMM form factor, measuring just 67.6mm x 32mm.
The CM3S is a cost-effective, and highly versatile solution for a wide range of applications. Despite its small size, this device is a true powerhouse. This variant offers 2GB of LPDDR4 RAM and a 32GB eMMC storage, as well as Wi-Fi and Bluetooth configuration. ;The CM3S accelerates product development by providing a powerful SoM in a compact form factor. With a simple carrier board (a 2-layer baseboard is sufficient to provide access to all functions of the SoM), engineers can rapidly develop solutions and prepare the boards for production.This model has certain features like wireless communication capabilities or eMMC.
CPU: Quad‑core Arm® Cortex®‑A55 (ARMv8) 64‑bit @ 1.6GHz ;GPU: Arm Mali™‑G52‑2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1 ;NPU: 0.8 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc ;Memory: 32bit LPDDR4X 2GB ;Storage: eMMC 5.1 32GB;Display: Single display engine, HDMI2.0, Dual MIPI‑DSI ;Multi‑Media: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder ;Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI‑2 and DVP interface ;Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels ;High-Speed Interface: One SATA 3.0/PCIe 2.1 combo port, and one USB 2.0 OTG ;Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to de-bug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)
802.11 b/g/n Wireless LAN (Wi‑Fi 4) ;BT 4.2 with BLE ;up to 5 x I2C;up to 3 x SPI ;up to 8 x UART ;up to 12 x PWM ;up to 60x GPIO ;1 x ADC ;2 x I2S ;1 x PCIe 2.0, 1 lane host (5Gbps) ;1 x SATA 3.0(shared with PCIe) ;1 x USB 2.0 OTG ;1 x SDIO 3.0 ;1 x HDMI up to 4K x 2k@60Hz ;2 x 2 lane or 1 x 4 lane MIPI CSI camera port ;1 x MIPI DSI 2 lane @ 1.6Gbps per lane ;1 x MIPI DSI 4 lane @ 1.6Gbps per lane ;3.3V ∼ 5V power input ;260 pins SODIMM golden finger edge connector