Copper 1100 Vapor Chamber and Stacked Fin passive heatsink for 1U server solution up to TDP 180 Watts heat dissipation.

 

CPU Support

AMD EPYC

CPU Socket

SP3

Solution

1U Server and Up

Dimensions

120 x 82 x 27 mm

Weight

450 g

Material

Copper 1100 with Skiving Fin

Thermal Grease

Shin-Etsu 7762 Pre-printed