Thermal conductive silicone filler pad 6.0 W/mK in 0.5, 1mm and 2mm thick
Australia stock!
With an extremely high thermal conductivity 6.0 (W/m-K);
medium softness 86 Shore 00; with high tensile strength. This thermal conductive filler pad is a good
general purpose, competitively priced, material. The
thermal gap filler provides durability in harsh environments
whilst conducting heat away from electronic components.
With adhesive tape one side
- Extremely high thermal conductivity of 6 (W/m-K)
- Medium soft, gap filler, excellent heat dissipation whilst minimising heat resistance.
- Ceramic filled silicone
- Suitable for high power semiconductor module applications.
- Thermal Conductivity 6W.m/K
- Elongation: % 99
- Tensile strength: (Psi) 64
- -40 to 200°C Operating Temperature
- Flammability: UL94 V-O
- Specific gravity g/cm3: 2.46
- Insulation strength kV / mm: >10
- RoHS compliant
- Grey colour