Micro porous ceramic heat sink for compact and slim electronic products  

• Micro-porous with a large surface area vs. metal heat sinks 
• Excellent  heat dissipation
• Lowest thermal capacity of unit volume vs. metal heat sinks.  
• Comes with thermal adhesive tape 
• RoHS compliant. 
• Ideal for LED TV, set top box, motherboard, broadband box. 
• What's in the box: 2 X heat sinks 2.5 X 30 X 30 mm
• Low profile, light weight, flat 
• Thermal Resistance: 10.21°C/W 
• Non electrically conductive, no antennae effect 
• High thermal capacity, low thermal dissipation 
• Micro porous ceramic dissipates heat faster than metal heat sink 
• No storage of heat within itself as non metal 
• 30% more surface area than metal heat sink
• Thermally conductive adhesive tape
• Pull tab for direct IC surface mount 
• All specifications shown herein are typical values and are not guaranteed. 
• It is recommended to test in application for suitability.