HPA552RTC is a unique high gain Push-Pull HF Power Amplifier designed for maximum reliability and durability, Equipped with a sophisticated multi-protection circuit that makes it almost impossible to burn (damaged) by any load mishmash even if output is totally open or short circuit. (*as long as installation instructions are followed.)
HPA552RTC is capable to deliver 500W PEP on your 50 Ohm load, antenna or any next RF stage.
For AM operation it normally operates at 125W Un-modulated CW carrier for 100% modulation capability (500W PEP)
Specifications:
High Gain Push Pull Class AB RF Power Amplifier capable for all mode operation including SSB, AM, AM-C-QUAM FM, CW and digital modes
Output Power:
SSB: 500W PEP
AM: 500W PEP (125W carrier)
FM, CW, Digital modes: 250W
Power Supply:
Main: 50V/17A max peak current for the RF Stage (+VP pad on pcb)
Auxiliary: 12V/150mA for the protection circuits, biasing, relays etc. (VC pad on pcb)
Operating Frequency: 1-2 Mhz
RF IN:
3W PEP input Drive Power
High-SWR, High-Temperature Over-Power and Over Drive, complete protection circuit on board.
Wide range biasing regulator.
Almost plug and play design,
no need for any adjustments,
Just install as per instructions and it's ready to operate.
On Board Directional Coupler output for easy Forward - Reflected measurements with just an external Voltage or uA meter.
(F and R pads on pcb)
Basic Low Pass Filtering also included on board.
TX-RX relay circuit On Board, ready for transceiver operation.
Installation instructions:Some minimum RF power technician experience is required as with any project like this.
Always use a heatsink capable to handle an amplifier of this power level and always use forced air to cool down the heatsink. No need for copper heat spreader if your heatsink has at least 10mm of "body plate".
Ensure a minimum air flow also on the component side of the amplifier board.
The amplifier uses 4pcs of high power MOSFETs that needs to be isolated from the heatsink, to do so only use high quality mica glass isolators, (no more than 0.08-0.1mm thickness) and use a small amount of thermal paste on both sides of the mica, spread the paste in a very thin layer across the entire mica surface.
Never use silicone or plastic or other types of insulators as they are transferring temperature slower and MOSFETs will be damaged.
Apply a small amount of thermal paste to attach the onboard thermal sensor (marked as TPS on pcb)
to the heatsink.
Also use a small piece of thermal pad of 0.5mm thickness between NTC thermal sensor board to attach on the top of the 4th power MOSFET.
Always use 50 Ohm coaxial cables to connect input and output of the amplifier to previous and next stages.
BSC pad on pcb, short this pad to GND to cut off the bias voltage, (eliminates output Power)
video of operation here :
https://youtu.be/DC3CqKo7llM?si=jXe868XLUIXEkp2C
If you have any question about the condition, accessories, or anything about the product, Please feel free to message us.
We are glad to answer all your concerns.
No responsible for fees and taxes in your country .
The estimated shipping time from ebay is not correct , you will receive the item much sooner !!!!!!
Professional boxing, plenty of bubble wrap and foam to ensure safe arrival !!!!!