Xeon Platinum 8168 OEM SR37J, LGA 3647, 33MB L3, 2,7 GHz (inkl.MwSt/VAT)
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon Platinum |
| Model number | |
| Frequency | |
| Maximum turbo frequency | |
| Bus speed | 10.4 GT/s Ultra Path Interconnect |
| Clock multiplier | 27 |
| Package | 3647-land Flip-Chip Land Grid Array (FC-LGA) |
| Socket | Socket 3647 / P0 / LGA3647-0 |
| Size | 2.99" x 2.22" / 7.6cm x 5.65cm |
| Fan/heatsink | 2U form factor |
| Architecture / Microarchitecture | |
| Instruction set | x86 |
| Microarchitecture | Skylake |
| Platform | Purley |
| Processor core | Skylake-SP |
| Core stepping | |
| CPUIDs | |
| Manufacturing process | 0.014 micron |
| Die | XCC type |
| Data width | |
| The number of CPU cores | 24 |
| The number of threads | |
| Floating Point Unit | Integrated |
| Level 1 cache size | 24 x 32 KB data caches |
| Level 2 cache size | |
| Level 3 cache size | |
| Physical memory | 768 GB |
| Multiprocessing | Up to 8 processors |
| Extensions & Technologies |
|
| Security Features |
|
| Low power features | Enhanced SpeedStep technology |
| Integrated Graphics Processing Unit | |
| None | |
| Integrated peripherals / components | |
| Memory controller | Memory channels (per controller): 3 Memory channels (total): 6 Supported memory: DDR4-2666 ECC supported: Yes |
| Other peripherals |
|
| Electrical / Thermal parameters | |
| Maximum operating temperature | 85°C (case temperature) 101°C (Digital Thermal Sensor) |
| Thermal Design Power | 205 Watt |
| Notes on Intel Xeon 8168 | |
| |
| Artikelnummer: | Art.421 |
| Hersteller: | Intel |
| Herstellernummer: | SR37J |
| Angebotspaket: | Nein |
| Marke: | Intel |
| Prozessormodell: | Intel Xeon Platinum 8168 |
| Prozessortyp: | Xeon |
| Anzahl der Kerne: | 24 |
| Taktfrequenz: | 2,7 GHz |
| Sockeltyp: | LGA 3647 |
| L3-Cache: | 33 MB |
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