8786D 2In1 BGA SMD Soldering Rework Station Hot Air Gun soldering iron 110V 220V
Features:
1.Panel tilt design is more convenient.
2.Soldering iron seat tops to stabilize space.
3.Microcomputer control,warming-up quickly.
4.PID technology to enhance temperature stability.
5.Adjust the airflow and temperature control rotation easily.
6.Dual LCD digital displays to show precision temperature.
7.Suitable for SOIC, CHIP, QFP, PLCC, B-G-A and temperature-sensitive components.
8.Fits for heating shrink, drying, lacquer removal, viscidity removal, ice-out, pre-heating and glue soldering.
Specification:
Model:8786D-I
Color:Black
Material:Stainless steel+ABS Plastic
Size:about 148*99*134±5(mm)
[Conversion: 1mm=0.03937 inch, 1inch=25.4 mm]
Voltage: AC 110V
Power:700W
Work Temperature:0-40°C
Temperature Stability:±2°C (static state)
Airflow Type:Brushless Fan (gentle wind)
Airflow volume:120L/min
Soldering Temperature:200 - 480°C
Display: Double LCD
Temperature control method:Microcomputer PID
10 minutes sleep:Yes
Digital correction temperature:Yes
Airgun automatic start/stop:Yes
Hot and cold air switching:Yes
Machine
Rated voltage 240V/230V/220V/110V ±10% 50Hz/60Hz
Whole device power ≤740W
Work environment: 0~40°C
Storage temperature: -20~80°C
Storage Humidity: 35%~45%
Hot air gun part
Temperature range: 100°C~480
Temperature stability: ±2°C（Static state）
Airflow type: Brushless fan gentle wind
Airflow: 120L/min (MAX)
Soldering iron part
Work voltage: 26V±10% 50Hz/60
Temperature range: 200°C~480°C
Temperature stability: ±2°C (Static state)
Tip-to-ground impedance: ＜2Ω
Tip-to-ground voltage: ＜2mV
Application
1. Suitable for a variety of elements soldering and de-soldering such as SOIC, CHIP, QFP, PLCC, BGA (especially suitable for mobile phone board and cable de-soldering).
2. For thermal shrinkage, drying, paint, adhesive removal, thawing, preheating, welding glued.
1.Panel tilt design is more convenient.
2.Soldering iron seat tops to stabilize space.
3.Microcomputer control,warming-up quickly.
4.PID technology to enhance temperature stability.
5.Adjust the airflow and temperature control rotation easily.
6.Dual LCD digital displays to show precision temperature.
7.Suitable for SOIC, CHIP, QFP, PLCC, B-G-A and temperature-sensitive components.
8.Fits for heating shrink, drying, lacquer removal, viscidity removal, ice-out, pre-heating and glue soldering.
Specification:
Model:8786D-I
Color:Black
Material:Stainless steel+ABS Plastic
Size:about 148*99*134±5(mm)
[Conversion: 1mm=0.03937 inch, 1inch=25.4 mm]
Voltage: AC 110V
Power:700W
Work Temperature:0-40°C
Temperature Stability:±2°C (static state)
Airflow Type:Brushless Fan (gentle wind)
Airflow volume:120L/min
Soldering Temperature:200 - 480°C
Display: Double LCD
Temperature control method:Microcomputer PID
10 minutes sleep:Yes
Digital correction temperature:Yes
Airgun automatic start/stop:Yes
Hot and cold air switching:Yes
Machine
Rated voltage 240V/230V/220V/110V ±10% 50Hz/60Hz
Whole device power ≤740W
Work environment: 0~40°C
Storage temperature: -20~80°C
Storage Humidity: 35%~45%
Hot air gun part
Temperature range: 100°C~480
Temperature stability: ±2°C（Static state）
Airflow type: Brushless fan gentle wind
Airflow: 120L/min (MAX)
Soldering iron part
Work voltage: 26V±10% 50Hz/60
Temperature range: 200°C~480°C
Temperature stability: ±2°C (Static state)
Tip-to-ground impedance: ＜2Ω
Tip-to-ground voltage: ＜2mV
Application
1. Suitable for a variety of elements soldering and de-soldering such as SOIC, CHIP, QFP, PLCC, BGA (especially suitable for mobile phone board and cable de-soldering).
2. For thermal shrinkage, drying, paint, adhesive removal, thawing, preheating, welding glued.
