| Mfr Package Description | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-40 |
| Status | In Stock |
| Sub Category | EPROMs |
| Access Time-Max | 120.0 ns |
| I/O Type | COMMON |
| JESD-30 Code | R-GDIP-T40 |
| JESD-609 Code | e0 |
| Memory Density | 1048576.0 bit |
| Memory IC Type | UVPROM |
| Memory Width | 16 |
| Number of Functions | 1 |
| Number of Terminals | 40 |
| Number of Words | 65536.0 words |
| Number of Words Code | 64K |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Min | 0.0 Cel |
| Operating Temperature-Max | 70.0 Cel |
| Organization | 64KX16 |
| Output Characteristics | 3-STATE |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Code | WDIP |
| Package Equivalence Code | DIP40,.6 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies (V) | 5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 4.91 mm |
| Standby Current-Max | 1.0E-4 Amp |
| Supply Current-Max | 0.05 Amp |
| Supply Voltage-Nom (Vsup) | 5.0 V |
| Supply Voltage-Min (Vsup) | 4.5 V |
| Supply Voltage-Max (Vsup) | 5.5 V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | TIN LEAD |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 52.07 mm |
| Width | 15.24 mm |