| Mfr Package Description | 14 X 14 MM, 2.20 MM HEIGHT, 0.65 MM PITCH, PLASTIC, QFP-80 |
| Status | In Stock |
| Microprocessor/Microcontroller/Peripheral IC Type | DIGITAL SIGNAL PROCESSOR, OTHER |
| Address Bus Width | 18.0 |
| Barrel Shifter | NO |
| Boundary Scan | NO |
| Clock Frequency-Max | 66.0 MHz |
| External Data Bus Width | 8.0 |
| Format | FIXED POINT |
| Internal Bus Architecture | MULTIPLE |
| JESD-30 Code | S-PQFP-G80 |
| JESD-609 Code | e0 |
| Low Power Mode | NO |
| Number of Terminals | 80 |
| Operating Temperature-Min | -40.0 Cel |
| Operating Temperature-Max | 125.0 Cel |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | QFP |
| Package Shape | SQUARE |
| Package Style | FLATPACK |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2.45 mm |
| Supply Voltage-Nom | 5.0 V |
| Supply Voltage-Min | 4.75 V |
| Supply Voltage-Max | 5.25 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | TIN LEAD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65 mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 14.0 mm |
| Width | 14.0 mm |